Introduction:
Thermal heatsink paste, also known as thermal grease or thermal compound, is a material that is used to fill the microscopic gaps between the surface of a computer processor or other electronic component and its heatsink. The purpose of thermal paste is to improve the transfer of heat from the component to the heatsink, thereby helping to keep the component cool and prevent damage due to overheating.
Thermal heatsink paste is typically made of a mixture of silicone, metal oxide, or ceramic particles suspended in a grease-like substance. When the paste is applied between the component and heatsink, it fills in the gaps and creates a more direct contact between the two surfaces. This helps to increase the surface area for heat transfer and improve the efficiency of the cooling system.
The application of thermal paste is a crucial step in the installation or maintenance of electronic components, particularly high-performance CPUs or GPUs used in gaming or graphic design. Without thermal paste, the surface irregularities and microscopic gaps between the component and heatsink can cause air pockets to form, reducing the effectiveness of the cooling system and leading to overheating and potential damage.
When applying thermal paste, it is important to use the correct amount and to spread it evenly across the surface of the component. Too much or too little thermal paste can affect the performance of the cooling system, and uneven application can lead to hot spots that cause damage over time.
In conclusion, thermal heatsink paste is an important component in the cooling systems of electronic components. It helps to improve the transfer of heat from the component to the heatsink, preventing damage due to overheating. Correct application of thermal paste is crucial to the effective functioning of the cooling system, and it is important to use the correct amount and apply it evenly to ensure reliable and efficient cooling.
Heat sink Thermal CPU Compound PC Grease Paste. Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heat sink to keep your CPU from overheating. This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. This thermal transfer compound improves the effectiveness of CPU coolers by thermally bonding the CPU to the heat sink. This ensures that the heat sink and fan can work at their full capacity to remove the harmful heat away from the CPU, and prevent burnout or heat damage
Features:
- Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heat sink in order to keep your CPU from overheating.
- This thermal grease can be used on the rear side of the heat sink which has no thermal pad.
- It will improve the heat dissipation.
- This thermal transfer compound improves the effectiveness of CPU coolers by thermally bonding the CPU heat sink.
- This ensures that the heat to the sink and fans can work at their full capacity to remove the harmful heat away from the CPU, and prevents burnout or heat damage.
Specifications:
- Type: Silicone Fluid with 20% Metal Oxide
- Thermal conductivity: 1.829 W/m-k
- Thermal resistance: 0.123 C-in2/w
- Dielectric Breakdown: 5.0 KV ac
- Paste Colour: Grey
Package Contents:
- Grey Heat Sink Thermal CPU Compound PC Grease Paste